February 2020

Presse Release OSM-MX8MM

OSM (Open Standard Module) with NXP i.MX 8M Mini / Nano CPU

F&S Elektronik Systeme GmbH presents prototype of a direct solder module.

As part of the SGET, the standardization group SDT.05 was founded jointly by iesy GmbH, F&S Elektronik Systeme GmbH and Kontron AG. The aim of this group is a new standard for directly solderable modules. In the meantime, further 13 companies work on this standard.
Currently 4 sizes of 15 x 30mm, 30 x 30mm, 45 x 30mm and 45 x 45mm are planned.
There will be modules from different providers in every size, also with different CPUs.
A pre-release of the new standard will be available for embedded world 2020.

F&S Elektronik Systeme has been developing and producing embedded boards in Stuttgart for more than 20 years and offers a wide range of modules with NXP CPUs (from i.MX 6 Cortex-A7 to i.MX 8 Cortex-A53 quad-core).
F&S Elektronik Systeme has developed a small (30 x 30mm) prototype so that potential customers of an OSM module not only have to look at graphic designs, but can also pick up a “real” module. A current NXP CPU, the i.MX 8 M Mini with 4x Cortex-A53 @ 1.8GHz, was selected. A powerful CPU with a lot of computing power and 2D / 3D graphics unit and video decoder. The pin-compatible i.MX 8 M Nano CPU can alternatively be equipped. RAM, flash on board and interfaces such as LAN, USB, SDIO, UART, I2C, SPI, audio, GPIO, MIPI-CSI and MIPI-DSI are available.

Interested visitors can see the module at the F&S Elektronik Systeme booth at embedded world 2020 (Hall 2-138) and ask questions.

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