Heat Sink OSM Size-S

SKU: MHS.OSM.2 12,- € Tax not included

Description

Depending on the CPU used on the OSM and the application software, the power dissipation can be more than 5W. The ambient temperature must also be taken into account. The maximum junction temperature must not be exceeded.
(can be read out via a SW command and is specified in the hardware documentation).
This Heat Sink complements the Heat Spreader MHS.OSM.1 and extends the cooling.

Technical Data

Available for

• OSM Size-S

Scope of Delivery

• 1 piece bulk packaging: 1x heat sink (B.MKUE.5) and 1x self adhesive thermal pad (B.WMLP.2)
• 100 pieces bulk packing: 100x Heat Spreader (B.MKUE.5) and 100x self adhesive Thermalpad (B.WMLP.2) (€4,-- per piece for 100 pieces; other quantities available on request)