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OSM™
The Open Standard Module (OSM) is an industrial standard for solder-on modules, published by SGeT. While the OSM standard accommodates various sizes (Size 0, S, M, L), F&S focuses specifically on OSM Size-S.
Using OSM Size-S offers numerous advantages. Here are some key reasons to consider using OSM Size-S:
- Compact and Powerful Design:
OSM Size-S provides an optimal balance between size and computing power. With a footprint of just 30 x 30 mm, it offers enough space for high-performance 64-bit processors such as the i.MX8M Mini with 4x Cortex A53 (1.8GHz) or the i.MX93 with 2x Cortex-A55 (1.7GHz), including DDR-RAM and eMMC Flash. - Faster Time-to-Market and Cost Efficiency:
The standardized formfactor and uniform interfaces significantly reduce development time.
The modules can be assembled with pick-and-place machines within the SMD production line, eliminating the need for manual assembly and screwing. - Future-Proofing and Investment Protection:
The modules can be easily swapped to adapt to changing requirements, ensuring long-term investment protection. - Reduced Development Risks:
OSM Size-S is based on an established industrial standard supported by many manufacturers, minimizing the risk of incompatibilities and technical issues. Extensive documentation (Design-In, processing) helps to avoid errors in the carrier board development. The software is optimally tuned to the modules and undergoes extensive testing (e.g., temperature, compliance, cooling) to ensure stability. - Robustness and Reliability:
The use of LGA pads ensures a stable and reliable connection, which is especially beneficial in demanding harsh environments.
All modules are available in industrial temperature ranges as well.
Further information on OSM (specification, design guide) is available at the following link:
Open Standard Module (OSM) standard and specifications - SGET
| FS 8MM OSM-SF | FS 8ULP OSM-SF | FS 91 OSM-SF | FS 93 OSM-SF | |
| State | Samples | Samples | Q4/2024 | Mass Production |
| CPU | - | - | - | - |
| CPU | NXP i.MX 8M Mini | NXP i.MX 8ULP | NXP i.MX 91 | NXP i.MX 93 |
| Core | ARM Cortex-A53 + Cortex-M4 | ARM Cortex-A35 + Cortex-M33 + Hifi 4 DSP | ARM Cortex-A55 | ARM Cortex-A55 + Cortex-M33 + NPU |
| No of Cores | 1/2/4 A53 + M4 | 1/2 A35 + M33 + Hifi 4 DSP | 1x A55 | 1/2 A55 + M33 |
| Frequency | max. 1,8GHz + 400MHz | 800MHz + 216MHz + 600MHz | 1,4GHz | 1,7GHz + 250MHz |
| L2-Cache | 512kB | 512kB | 256kB L2 | 2x64kB L2 + 256kB L3 |
| GPU | 2D, 3D | 2D, 3D | - | PXP |
| VPU | 1080p60 HEVC H.265, VP9, H.264, VP8 | - | - | - |
| Operating System | - | - | - | - |
| Linux | Yocto (uboot installed) |
Yocto (uboot installed) |
Yocto (uboot installed) |
Yocto (uboot installed) |
| Real Time | FreeRTOS | FreeRTOS | - | FreeRTOS |
| Memory | - | - | - | - |
| Flash | 64 kbit EEPROM | 64 kbit EEPROM | 64 kbit EEPROM | 64 kbit EEPROM |
| eMMC | max. 64GB | max. 32GB eMMC | max. 64GB | max. 64GB |
| RAM | max. 8GB LPDDR4 | max. 2GB LPDDR4x32 | max. 2GB LPDDR4 x16 | max. 2GB LPDDR4 x16 |
| Interfaces | - | - | - | - |
| SD-Card | 2x SDIO | 1x SDIO | 1x SDIO | 1x SDIO |
| Ethernet | RGMII | 1x RMII | 2x RGMII | 2x RGMII |
| USB Host | 1x 2.0 | 1x OTG 2.0 | 1x OTG 2.0 | 1x OTG 2.0 |
| USB Device | 1x OTG 2.0 | 1x OTG 2.0 | 1x OTG 2.0 | 1x OTG 2.0 |
| CAN | - | 1x | 2x CAN-FD | 2x CAN-FD |
| UART | 3x + Console | 5x | 4x | 4x |
| I2C | 4x | 3x | 3x | 4x |
| SPI | 2x | 2x | 2x | 2x |
| Audio | 1x I2S | 2x I2S_A/_B |
I2S | I2S |
| Digital I/O | 22 GPIO_A/_B/_C |
18 GPIO_A/_B/_C[4..7] |
10 GPIO_A+_C[4..7] |
10 GPIO_A+_C[4..7] |
| ADC | - | - | 2x | 2x |
| Touch Panel | analog resistive and PCAP Touch ext. via I2C | Touch via I2C | - | Touch via I2C |
| Camera analog/digital | MIPI-CSI | MIPI-CSI (2 lanes) | - | MIPI-CSI (2 lanes) |
| PCIe | 1x | - | - | - |
| RTC | PCF85263ATL | PCF85263ATL | PCF85263ATL | PCF85263ATL |
| additional Interfaces | 3x PWM, BL-PWM | 5x PWM, BL-PWM | 2x PWM, BL-PWM | 2x PWM, BL-PWM |
| Display | - | - | - | - |
| RGB | - | 18 (24) bit | - | - |
| LVDS | - | - | - | 1x 4 Lanes |
| MIPI-DSI | 1x 4 Lanes | 1x 4 Lanes | - | 1x 4 Lanes |
| Common | - | - | - | - |
| Supply Voltage | 5V DC/±5% | 5V DC/±5% | 5V DC/±5% | 5V DC/±5% |
| Power Consumption | 3W typ. | 2W typ. | 3W typ. | 3W typ. |
| Operating Temperature | 0°C - +70°C opt. -20°C - +85°C opt. -40°C - +85°C |
0°C - +70°C opt. -20°C - +85°C opt. -40°C - +85°C |
0°C - +70°C opt. -20°C - +85°C opt. -40°C - +85°C |
0°C - +70°C opt. -20°C - +85°C opt. -40°C - +85°C |
| Size | 30x30mm (LxB) |
30x30mm (LxB) |
30x30mm (LxB) |
30x30mm (LxB) |
| Weight | ~5g | ~5g | ~5g | ~7g |
| Long Term Availability | 2034 | 2035 | 2040 | 2039 |
| FS 8MM OSM-SF | FS 8ULP OSM-SF | FS 91 OSM-SF | FS 93 OSM-SF |
Open Standard Module (OSM) is a standard for solder-on modules published by SGeT.
Further information on OSM (specification, design guide) is available at the following link:
Open Standard Module (OSM) standard and specifications - SGET
FS OSM-SF
- OSM Implementation Guide (742 KB, pdf) - 11/11/2024
- OSM Cooling Solution (592 KB, pdf) - 16/04/2024
- OSM Carrier Board Design Library (12 MB, zip) - 23/10/2024
- SGeT OSM standard - (external link)
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
FS OSM-SF - Quick Facts
- FS 8MM OSM-SF (351 KB, pdf) - 30/10/2024
- FS 8ULP OSM-SF (355 KB, pdf) - 17/10/2024
- FS 91 OSM-SF (376 KB, pdf) - 17/10/2024
- FS 93 OSM-SF (357 KB, pdf) - 17/10/2024
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
