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SolderCore™™
| SolderCore™8ULP | |
| State | Samples |
| CPU | - |
| CPU | NXP i.MX 8ULP |
| Core | ARM Cortex-A35 + Cortex-M33 + Hifi 4 DSP |
| No of Cores | 1-2x A35 + 1x M33 + Hifi 4 DSP |
| Frequency | 1GHz + 216MHz + 600MHz |
| GPU | 2D / 3D GPU OpenGL/CL 3.1 |
| Operating System | - |
| Linux | Yocto (uboot installed) |
| Real Time | FreeRTOS |
| Memory | - |
| eMMC | 32GB eMMC |
| RAM | 2GB LPDDR4 |
| Interfaces | - |
| SD-Card | max. 2x external |
| Ethernet | 1x 100 Mb |
| USB Host | 1x OTG 2.0 |
| USB Device | 1x OTG 2.0 |
| CAN | Flex CAN |
| UART | max. 8x |
| I2C | max. 6x / max. 3x I3C |
| SPI | max. 4x |
| Audio | max. 6x I2S |
| Touch Panel | Touch via I2C |
| Camera analog/digital | 0/MIPI-CSI |
| RTC | CPU or external IC |
| additional Interfaces | EPDC |
| Display | - |
| RGB | 24 bit |
| MIPI-DSI | 1x 4 lanes |
| Common | - |
| Supply Voltage | 2.7V up to 5.5V DC/±5% |
| Power Consumption | tbd typ. |
| Operating Temperature | 0°C - +70°C opt. -40°C - +85°C |
| Size | 35x35mm (LxB) |
| Weight | 8g |
| Long Term Availability | 2035 |
| SolderCore™8ULP |
SolderCore is a module family with LGA contacts without connectors. The idea is to offer the customer almost all functions of the SoC used. Due to the size of the contacts and the position of the contacts, it is possible to use the module in combination with a four-layer carrier board.
For the start of development, we recommend:
