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SolderCore8ULP
Solder Module with NXP i.MX8ULP CPU
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For the start of development, we recommend:
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| SolderCore™8ULP | ||
| State | Samples | |
| CPU | ||
| CPU | NXP i.MX 8ULP | |
| Core | ARM Cortex-A35 + Cortex-M33 + Hifi 4 DSP | |
| No of Cores | 1-2x A35 + 1x M33 + Hifi 4 DSP | |
| Frequency | 1GHz + 216MHz + 600MHz | |
| GPU | 2D / 3D GPU OpenGL/CL 3.1 | |
| Operating System | ||
| Linux | Yocto (uboot installed) | |
| Real Time | FreeRTOS | |
| Memory | ||
| eMMC | 32GB eMMC | |
| RAM | 2GB LPDDR4 | |
| Interfaces | ||
| SD-Card | max. 2x external | |
| Ethernet | 1x 100 Mb | |
| USB Host | 1x OTG 2.0 | |
| USB Device | 1x OTG 2.0 | |
| CAN | Flex CAN | |
| UART | max. 8x | |
| I2C | max. 6x / max. 3x I3C | |
| SPI | max. 4x | |
| Audio | max. 6x I2S | |
| Touch Panel | Touch via I2C | |
| Camera analog/digital | 0/MIPI-CSI | |
| RTC | CPU or external IC | |
| additional Interfaces | EPDC | |
| Display | ||
| RGB | 24 bit | |
| MIPI-DSI | 1x 4 lanes | |
| Common | ||
| Supply Voltage | 2.7V up to 5.5V DC/±5% | |
| Power Consumption | tbd typ. | |
| Operating Temperature | 0°C - +70°C opt. -40°C - +85°C | |
| Size | 35x35mm (LxB) |
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| Weight | 8g | |
| Long Term Availability | 2035 |
| SolderCore™8ULP-V4-LIN | |
| State | Samples |
| CPU | - |
| CPU | NXP i.MX 8ULP |
| Core | ARM Cortex-A35 + Cortex-M33 |
| No of Cores | 2 + -M33 |
| Frequency | 1GHz + 216MHz |
| GPU | 2D / 3D GPU OpenGL/CL 3.1 |
| Operating System | - |
| Linux | Yocto (uboot installed) |
| Real Time | FreeRTOS |
| Memory | - |
| eMMC | 4GB eMMC |
| RAM | 1GB LPDDR4 |
| Interfaces | - |
| SD-Card | 2x external |
| Ethernet | 1x 100 Mb |
| USB Host | 1x OTG 2.0 |
| USB Device | 1x OTG 2.0 |
| CAN | Flex CAN |
| UART | 8x |
| I2C | 6x /3x I3C |
| SPI | 4x |
| Audio | 6xb I2S |
| Touch Panel | Touch via I2C |
| Camera analog/digital | 0/MIPI-CSI |
| RTC | CPU |
| additional Interfaces | EPDC |
| Display | - |
| RGB | 24 bit |
| MIPI-DSI | 1x 4 lanes |
| Common | - |
| Supply Voltage | 2.7V up to 5.5V DC/±5% |
| Power Consumption | tbd typ. |
| Operating Temperature | 0°C - +70°C |
| Size | 35x35mm (LxB) |
| Weight | 8g |
| Long Term Availability | 2035 |
| SolderCore™8ULP-V4-LIN |
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Starterkit SolderCore™8ULP Linux SolderCore™8ULP-V4-LIN, base board, cable kit, 3.5" MIPI-DSI Display, access data to documentation and software SKU: SC8ULP-SKit |
990,- € |
Software
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Secure Boot as a Service The SBS (Secure Boot as a Service) includes the signing (protection against manipulation) and if necessary encryption (protection of intellectual property) by F&S Elektronik Systeme. SKU: Linux-SBS |
500,- € |
Touch-Kits
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Resistive Touch Kit 2 For the connection of a resistive touch panel to boards with 6pol Hirose socket. SKU: SINTF-ADP-RTI2C |
Request | ||
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PCAP Touch Kit for EDT Kit to connect an EDT PCAP touch panel SKU: ADP-EDTTOUCH2 |
35,- € | ||
Cables
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Capacitive Touch Cable 6-pin cable with matching connector for connecting an I2C touch to F&S boards SKU: B.MKAB.47 |
10,- € |
Workshops
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Workshops Workshops for F&S Boards with Windows Embedded Compact or Linux - Beginner Workshops - Qt 5 - Asymmetric Multiprocessing - Secure Boot SKU: NDCU-WS1 |
Request | ||
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Secure Boot as a Package Secure Boot as a Package contains a workshop, where you learn how to realize the topic Secure Boot. You will also receive a user Tool Software. SKU: WS-SBP |
500,- € | ||
Other Accessories
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USB Stick USB Memory Stick with common memory size (2GB+) and imprinted F&S logo. The USB Stick was tested on all current F&S boards. SKU: USBSTICK.1 |
20,- € |
Buildroot und Yocto
Das Linux-BSP "fsimx6-B2022.10" basiert auf Buildroot, einer Software zur Erstellung von Root-Filesystemen. Über Buildroot können menügesteuert ca. 1400 verschiedene Softwarepakete dem Root-Filesystem hinzugefügt werden. Der Funktionsumfang reicht hier von einfachen Bibliotheken und Utilities über eine komplette Java-Umgebung bis hin zu vollständigen grafischen Umgebungen wie Qt, Wayland/Weston oder X11, inklusive Applikationen wie z.B. einem HTML5-fähigen Webbrowser. Auf diese Weise lässt sich sehr einfach ein maßgeschneidertes Linux-System zusammenstellen.
Alternativ zu Buildroot gibt es auch eine Yocto-basierte Umgebung. Wir bieten das Linux BSP fsimx6-Y2022.09 an, das auf Yocto basiert.
Unsere Standardkonfiguration, die einen ersten Eindruck vom Funktionsumfang der Baugruppe geben soll, enthält unter anderem folgende Features: Busybox, gdb, alsa-utils, gstreamer, fbv, X11R7, matchbox, feh, openssl, openssh, ncurses, can-utils, iproute2, ftpd, httpd, telnet, tftp, u.v.m.
Beide BSPs beinhaltet die von F&S angepassten Quelltextpakete von U-Boot (2018.03), Linux-Kernel (basierend auf 5.4.70) und Buildroot (2021.02.10) oder Yocto (3.0). Außerdem ist unsere Cross-Toolchain beigefügt, einige Beispielsapplikationen, sowie alle Binaries in der Standardkonfiguration. Und nicht zuletzt sind ausführliche Dokumente zur Hardware enthalten sowie die First-Steps-Dokumentation für den leichten Einstieg.
F&S bietet auch eine Virtuelle Maschine (basierend auf VirtualBox) mit einem installierten Linux basierend auf der Distribution Fedora 27 zum kostenlosen Download an. Alle zum Übersetzen unserer Software notwendigen Pakete sind bereits installiert. Ebenfalls sind alle Services (NFS, TFTP) zum Arbeiten mit unseren Boards installiert. Unser BSP liegt ausgepackt und vorkompiliert in den richtigen Verzeichnissen. Mit dieser virtuellen Maschine spielt es keine Rolle ob sie als Host Windows oder Linux verwenden. Einfach die VHD downloaden, in VirtualBox importieren und die Entwicklung kann sofort beginnen.
➜ Mehr Informationen über das neue Buildroot Release B2022.10
➜ Mehr Informationen über das neue YOCTO Release Y2022.09
SC8ULP - Product Flyer
- English (479 KB, pdf) - 18/04/2023
Usage
By downloading you accept our general terms and conditions.
SC8ULP - Hardware
- SC8ULP Hardware Documentation (448 KB, pdf) - 17/04/2023
- SC8ULP Starterkit Hardware Documentation (448 KB, pdf) - 31/01/2024
- Baseboard Circuit Diagram (1.3 MB, pdf) - 01/06/2022
- Baseboard 3D Step Model
- SC8ULP Ethernet Adapter (987 KB, pdf) - 18/06/2024
- SC8ULP Battery Adapter (1018 KB, pdf) - 19/06/2024
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
SC8ULP - Linux
- Advice for Linux on PC (2 MB, pdf) - 10/01/2018
- i.MX 8ULP Linux First Steps (3.4 MB, pdf) - 19/06/2024
- DOTNET on F&S Boards (1.1 MB, pdf) - 19/06/2024
- Visual Studio Code C/C++ Application Development (455 KB, pdf) - 29/05/2024
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
Usage
By downloading you accept our general terms and conditions.
Variants
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SolderCore™8ULP-V4-LIN NXP i.MX 8ULP ARM Cortex-A35 + Cortex-M33, 1GB RAM, 4GB eMMC, Audio, MIPI-DSI, 0°C - +70°C, 5V Supply, Linux Yocto SKU: SC8ULP-V4-LIN |
Request | ||
Starterkit
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Starterkit SolderCore™8ULP Linux SolderCore™8ULP-V4-LIN, base board, cable kit, 3.5" MIPI-DSI Display, access data to documentation and software SKU: SC8ULP-SKit |
990,- € |
Link to the Forum
You will always find support in our Forum.
Current Contributions
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16 Dec, 17:51 |
Repartitioning NAND Flash (via Yocto/ Patch) |
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12 Dec, 09:21 |
SPIDEV probe function not called |
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11 Dec, 12:16 |
CANscan: Powerful CAN Bus Testing and Communication Tool with Avalonia UI |
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10 Dec, 09:13 |
request to introduce a github repo also for the toolchain with corresponding history |
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05 Dec, 06:29 |
WEC 2013: How to close UDP Ports 137 and 138 / how to disable NetBIOS over TCP/IP |
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04 Dec, 12:48 |
New i.MX8MP GPU Driver |
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04 Dec, 09:32 |
Prevent efusA9 with WEC 2013 from sending Device Info |
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03 Dec, 08:58 |
Change to winter time |
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02 Dec, 15:12 |
Question: eMMC vs NAND storage |
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30 Nov, 11:59 |
armStone A5 in a Plexlog Datalogger |
| Compact Solder Module | Long-Term Availability until minimum 2035 | |
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Our small, compact SolderCore solder-on module is the ideal solution for the i.MX 8ULP from NXP. The extremely power-saving CPU i.MX 8ULP is especially suitable for portable, battery-powered devices. The SolderCore8ULP makes it easy to connect all important interfaces to a baseboard. Heterogeneous multicore processor conceptThe i.MX 8ULP is a heterogeneous multicore application processor for embedded modules. It is ideal for applications that require high-performance graphics processing and multimedia functions and Industry 4.0 applications. |
The highlights of our module are
We offer extensive software support including Linux BSP, Update Solution, and Secure Boot. This makes the SolderCore™MX8ULP a perfect solution for all kinds of ultra-low power devices. Operating SystemThe operating system customized for SolderCore8ULP is Linux. Linux Yocto supports all interfaces, ensuring easy software development without much hardware knowledge. NXP i.MX 8ULP Linux Development BoardFor an easy development start we offer an immediately executable SolderCore8ULP starter kit. It includes an embedded board, a baseboard, a 3.5" MIPI display, cables, and access to documentation and software. The software consists of the Board Support Package and Bare Metal or FreeRTOS toolchain. This is rounded off by our wide range of software services, workshops and free support via the forum, e-mail and telephone. |
