9 March 2026

F&S Unveils Multi Form Factor Module Portfolio With Medical and Industrial Demos at Embedded World 2026

F&S Unveils Multi Form Factor Module Portfolio With Medical and Industrial Demos at Embedded World 2026

 At Embedded World 2026, NXP® Semiconductors and F&S Elektronik Systeme present a comprehensive, multi form factor embedded module portfolio addressing the growing demand for functional safety, security, and edge AI across industrial and medical applications. The collaboration showcases production-ready hardware and software platforms ranging from SMARC and M.2 modules to complete medical and industrial demonstrations.

A key highlight of the portfolio is the FSSM95AI SMARC System-on-Module, built on the NXP i.MX 95 applications processor. Designed from the ground up for safety-critical systems, the i.MX 95 SoC integrates safety islands, ECC-protected memories, fault detection mechanisms, and hardware-assisted partitioning. These features support compliance with IEC 61508 and ISO 26262, making the platform ideal for certified industrial control, HMI systems, robotics, and automation.

To enable true edge intelligence without compromising deterministic real-time behavior, the FSSM95AI  further integrates the  Ara240 Discrete Neural Processing Unit (DNPU) device. The power-efficient AI accelerator is optimized for modern workloads such as generative AI, transformer-based models, and complex edge inference. Its architecture allows AI processing to run isolated from safety-critical real-time functions, delivering high performance per watt while preserving system integrity in regulated environments.

The SMARC module supports up to 16 GB LPDDR5 memory and 128 GB eMMC, alongside a rich set of industrial interfaces including Gigabit Ethernet, USB 3.0/OTG, PCIe, CAN-FD, UART, I²C/SPI, GPIO, as well as dual MIPI-CSI camera and display interfaces. Integrated security options such as TPM 2.0 or NXP’s EdgeLock® SE050 secure element, tamper detection, and RTC support complement the safety architecture and enable secure device lifecycle management for long-term deployments.

Expanding beyond SMARC, F&S also demonstrates the ADP-ARA2M2 M.2 AI accelerator module, enabling customers to add scalable AI acceleration to existing NXP i.MX-based designs. Powered by  the Ara240 and delivering up to 40 eTOPS (INT8) at low power consumption, the module integrates via PCIe Gen4 x4 and supports leading AI frameworks including TensorFlow, PyTorch, ONNX, and MXNet. This modular approach allows system designers to flexibly scale AI performance across different form factors and product generations.

Medical and industrial demonstrations underline the breadth of the NXP–F&S partnership. A live medical visualization demo based on PicoCore MX93 running QNX OS 8.0 showcases deterministic real-time performance, a modern LVGL-based HMI, and a security architecture aligned with current FDA and IMDRF cybersecurity requirements.

The demo visualizes real-time physiological data such as ECG-like waveforms, SpO₂, heart rate, and respiration, highlighting suitability for patient monitoring and other regulated medical devices.

Across all showcased platforms, F&S emphasizes a unified ecosystem approach—combining NXP’s scalable i.MX applications processors, EdgeLock security technologies, and long-term availability with F&S’s production-ready modules, BSPs, and system expertise. This enables OEMs to deploy secure, functional-safe, and AI-enabled embedded systems faster, across multiple form factors and application domains.

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