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Processors

An important criterion for the board selection is the processor performance.
We offer a wide range of NXP processors:

Here you will find the right processor for your project - NXP processors are very versatile and offer solutions for the most diverse requirements: extremely low power consumption, high performance for multimedia applications, asymmetric multiprocessing, or artificial intelligence.

We offer solutions for industrial and medical applications.
All our NXP embedded modules are long-term available and we are ISO9001:2015 and ISO13485:2016 certified.

The members of our product families are compatible with each other and suitable for a wide range of requirements. Our armStone product family for example includes powerful PicoITX single board computers, while our tiny (only 35x40mm) PicoCore Computer on Modules also offer particularly power-saving models.

For each of our embedded boards, we offer development kits to enable an easy start of development. This is supported by our free support forum, which is maintained by the F&S engineers. They also help you via e-mail or phone.

All F&S Linux embedded modules are available with Buildroot or Yocto and include the board support package and the toolchain for Bare Metal or FreeRTOS (realtime). F&S publishes up to two software releases per year (update of uboot, kernel, root file system, toolchain).
Learn more about our software solutions

Product Overview

NXP Partner Program Gold Klein 2

Modules with NXP i.MX 8M Application Processor

The i.MX 8 series is an in-function and high-performance scalable multicore platform that includes processors based on Arm Cortex architecture, including combined Cortex-A53, Cortex-M4, and Cortex M7-based solutions for next-level graphics, imaging, audio, video, and safety-critical applications.
We offer this state-of-the-art CPU on our current form factors: PicoITX Single Board Computer armStone and PicoCore.

Click on the board name to get detailed information.

 


armStone™MX8M PicoCore™MX8MM PicoCore™MX8MN PicoCore™MX8MP SMARC™MX8M
State Samples Production Production Samples 2022
CPU - - - - -
CPU NXP i.MX 8M NXP i.MX 8M Mini NXP i.MX 8M Nano NXP i.MX 8M Plus NXP i.MX 8M
Core ARM Cortex-A53 + Cortex-M4 ARM Cortex-A53 + Cortex-M4 ARM Cortex-A53 + Cortex-M7 ARM Cortex-A53 + Cortex-M7 ARM Cortex-A53 + Cortex-M4
No of Cores Dual/ Quad 1, 2, 4 +M4 1, 2, 4 + M7 2, 4 + M7 Dual/ Quad
Frequency max. 1,5GHz max. 1,8GHz + 400MHz max. 1,5GHz + 650MHz max. 1,8GHz + 800MHz max. 1,5GHz
L2-Cache - 512KB 512KB 512KB -
GPU 3D GC7000 Lite (4 shader) 2D GC328, 3D GCNanoUltra (1 shader) 3D GC7000 UltraLite (2 shader) 3D/2D, ES 3.1/3.0, CL™ 1.2 VG™ 1.1 Vulkan
VPU MPEG2, MPEG4p2 H 263 up to 4Kp60 1080p60 HEVC H.265, VP9, H.264, VP8 - 1080p60, h.265/4, VP9, VP8,
Video Encode: 1080p60, h.265/4
MPEG2, MPEG4p2 H 263 bis 4Kp60
Operating System - - - - -
Linux Yocto Buildroot/ Yocto
(uboot installed)
Buildroot/ Yocto
(uboot installed)
Buildroot/ Yocto
(uboot installed)
Yocto
Real Time - FreeRTOS FreeRTOS FreeRTOS -
Memory - - - - -
Flash max. 1GB SLC NAND
max. 32GB eMMC
max. 512MB SLC NAND
or max. 32GB eMMC
max. 512MB SLC NAND
oder max. 32GB eMMC
max. 32GB eMMC EEPROM max. 1GB SLC NAND
max. 32GB eMMC
RAM max. 8GB LPDDR4 max. 8GB LPDDR4/DDR3L max. 8GB LPDDR4/ DDR3L max. 8GB LPDDR4 max. 8GB LPDDR4
Interfaces - - - - -
SD-Card 1x optional 1x external 2x extern max. 2x external 1x optional
Ethernet 1x 10/100/1000 Mbit max. 2x 100/1000Mb
opt. RGMII
max. 2x 100/1000Mb
opt. RGMII
max. 2x 100/1000Mb
opt. RGMII
1x 10/100/1000 Mbit
WiFi IEEE 802.11a/b/g/n 802.11 ac/a/b/g/n - 802.11 ac/a/b/g/n IEEE 802.11a/b/g/n
BT BT 2.1+EDR, 4.1 LE 5.0 LE - 5.0 LE -
USB Host 2x USB 3.0
2x USB 2.0
1x - 1x 2.0/ 3.0 4x
USB Device 1x USB3.0 OTG 1x OTG 2.0 1x OTG 2.0 1x OTG 2.0/ 3.0 1x OTG
CAN 1x 1x 1x max. 2x 1x
UART 3x
(1x RS232, 2x TTL)
max. 4x max. 4x max. 4x 3x
(1x RS232, 2x TTL)
I2C 4x max. 4x max. 4x max. 4x 4x
SPI 2x max. 2x max. 2x max. 2x 2x
Audio Line In/Out/Mic Line In/ Out/ Mic/ Headphone/I2S Line In/ Out/ Mic/ Headphone/I2S Line In/ Out/ Mic/ Headphone/ I2S Line In/Out/Mic
Digital I/O max. 32 - - - max. 32
Touch Panel analog reistive and PCAP Touch ext. via I2C analog resistive and PCAP touch ext. via I2C analog resistive and PCAP Touch ext. via I2C analog resistive and PCAP Touch ext. via I2C analog reistive und PCAP Touch ext. via I2C
Camera analog/digital 0/MIPI-CSI MIPI CSI MIPI-CSI max. 2x MIPI-CSI 0/MIPI-CSI
PCIe 1x with SIM Card Slot 1x - 1x 1x mit SIM Card Slot
RTC external external CPU or
external IC
additional Interfaces - max. 4x PWM, Watchdog,
SPDIF, ESAI,
SAI, SSI
max. 4x PWM, SPDIF, ESAI, SAI, SSI max. 4x PWM, SPDIF, ESAI, SAI, SSI BT 2.1+EDR, 4.1 LE
Display - - - - -
LVDS 2x 24bit 1-2x 24bit 1x 24bit 1-2x 4 Lanes or
1x 8 Lanes
2x 24bit
CRT/DVI 0/DVI - - -/1x 0/DVI
MIPI-DSI - 1x 4 Lanes 1x 4 Lanes 1x 4 Lanes -
Common - - - - -
Supply Voltage 5V DC/±5% +3.8V bis 5.5VDC +3.8V bis 5.5VDC +3.8V bis 5.5VDC 5V DC/±5%
Power Consumption tbd 3W typ. 2W typ. 3W typ. tbd
Operating Temperature 0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
opt. -40°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
Size 100x72x15mm
(LxBxH)
35x40mm
(LxB)
35x40mm
(LxB)
35x40mm
(LxB)
82x50mm
(LxB)
Weight ~60g ~10g ~10g ~10g ~40g
Long Term Availability 2033 2034 2034 2035 2028
armStone™MX8M PicoCore™MX8MM PicoCore™MX8MN PicoCore™MX8MP SMARC™MX8M

Modules with NXP i.MX 8X Application Processor

The i.MX 8X family extends the scalable product range of the i.MX 8 series. The i.MX 8X with ARM® Cortex®-A35 and -M4 incorporates common subsystems and architectures from the higher-end i.MX 8 families.
The i.MX 8X offers high integration capability for graphics, video, image processing and audio. It is the ideal partner when security and performance efficiency are paramount.
We offer this modern CPU on our current form factor efus (COM).

Click on the board name to get detailed information.

 


efus™MX8X
State Samples
CPU -
CPU NXP i.MX 8DualX/ QuadXPlus
Core ARM Cortex-A35 + -M4
No of Cores 2x, 4x A35 + M4F
Frequency 1.2GHz
L2-Cache 512KB (ECC)
GPU 2D, 3D (GC7000 Lite, 4 shader)
VPU 4Kp30
Operating System -
Linux Buildroot/Yocto
(uboot installed)
Real Time FreeRTOS
Memory -
Flash max. 512MB QSPI NAND
1MB QSPI NOR
max. 64GB eMMC
RAM LPDDR4 32 bit
Interfaces -
SD-Card external
Ethernet 2x 100/1000Mb (IEEE 1588, AVB)
WiFi 802.11ac/a/b/g/n
BT 5.0 LE with antenna socket
USB Host 1x USB 2.0 OTG
USB Device 1x USB 3.0 OTG
CAN 2x CAN-FD
UART 4x
I2C 4x
SPI 2x
Audio I2S
Touch Panel analog resistive and PCAP Touch ext. via I2C
Camera analog/digital 0/MIPI-CSI2/ Parallel 8bit
PCIe 1x PCIe 3.0 (1 lane)
RTC on board/ external IC
Display -
LVDS 2x 24bit
(max.1080p)
MIPI-DSI 2x 4 lanes
(max. 2x1080p)
Common -
Supply Voltage +5VDC/ ±5%
Power Consumption 3W typ.
Operating Temperature 0°C - +70°C
-20°C - +70°C
-40°C - +85°C
Size 47x62.1x11mm
(LxBxH)
Weight ~15g
Long Term Availability 2035
efus™MX8X

Modules with NXP i.MX 6 Application Processors

NXPiMX6

The i.MX 6 series is a scalable multi-core platform that includes single, dual and quad-core processors based on the ARM CortexA9 architecture.

Click on the board name for detailed information.

 


armStone™A9 armStone™A9r2 efus™A9 QBlissA9 QBlissA9r2 PicoMODA9
State Production Production Production Production Production Production
CPU - - - - - -
CPU NXP i.MX 6 NXP i.MX 6 NXP i.MX 6 NXP i.MX 6 NXP i.MX 6 NXP i.MX 6
Core ARM Cortex-A9 ARM Cortex-A9 ARM Cortex-A9 ARM Cortex-A9 ARM Cortex-A9 ARM Cortex-A9
No of Cores Solo/DualLite/Quad Solo/DualLite/Quad 1, 2, 4 Solo/DualLite/Quad Solo/DualLite/Quad/QuadPlus Solo/DualLite
Frequency max. 1.2GHz max. 1GHz max. 1GHz max 1.2GHz max 1GHz max. 1.2GHz
L2-Cache max. 1MB max. 1MB max. 1MB max. 1MB max. 1MB max. 1MB
GPU 2D, 3D 600Mpix/s 3D, 2D 600Mpix/s 2D, 3D 2D 600Mpix/s 3D 1000Mpix/s 2D 600Mpix/s
VPU 1080p60 1080p60 1080p60 1080p60 1080p60 1080p60
Operating System - - - - - -
Linux Buildroot
Yocto
Buildroot
Yocto
Buildroot
Yocto
(uboot installed)
Buildroot
Yocto
Buildroot
Yocto
Buildroot
Yocto
Windows WEC 7
WEC 2013
WEC 2013 WEC 7
WEC 2013
(Bootloader installed)
WEC 7
WEC 2013
WEC 7
WEC 2013
WEC 7
WEC 2013
Memory - - - - - -
Flash max. 512MB max. 512MB SLC
32GB eMMC
max. 512MB
max. 32GB eMMC
opt. SPI NOR
opt.I2C EEPROM
max. 32GB (SD-Card) max. 1GB SLC
max. 32GB eMMC
max. 1GB
eMMC - - max.32GB - - -
RAM max. 4GB max. 4GB DDR3L max. 2GB max. 4GB max. 4GB DDR3 max. 4GB
Interfaces - - - - - -
SD-Card 1x on-board 1x on-board 2x extern 1x extern 1x extern 1x extern/on-board
Ethernet 1x 10/100/1000Mb
IEEE1588
1x 10/100/1000Mb
IEEE1588
100/1000Mb 10/100/1000Mb
IEEE 1588
10/100/1000Mb
IEEE 1588
max. 10/100Mb
WiFi - IEEE 802.11a/b/g/n dual band - - - -
BT - BT 3.0 - - - -
USB Host 4x 4x 1x 4x 4x 1-2x
USB Device 1x 1x 1x 1x 1x 1x
CAN 1x 2x 2x 1x 1x 1x
UART 3x 5x 4x 1x 1x 4x
I2C 1x 1x 2x 2x 2x 1x
SPI 1x 2x 2x 1x 1x 1x (Software only)
Audio Line In/Out/Mic Line In/Out/Mic I2S AC97 AC97 Line In/Out/Mic
Digital I/O max. 66 max. 66 - - max. 66 max. 64
Touch Panel 4/5-wire, analog resistive and
PCAP Touch via I2C
4/5-wire, analog resistive and
PCAP Touch via I2C
analog resistive and PCAP Touch via I2C via I2C via AC97 4-wire, analog resistive;
PCAP Touch via I2C
Camera analog/digital - 0/MIPI-CSI 0/MIPI-CSI or Parallel 8bit 0/1 0/2x MIPI-CSI 0/1
PCIe 1x 1x 1x 1x 1x -
SATA 1x 1x 1x 1x 1x -
RTC - - on board/ external IC - - -
Display - - - - - -
RGB 18bit - 18bit - - 18bit
LVDS 2x 18bit/24bit 2x 18/24bit 2x 24bit 2x 18/24bit 2x 24bit 18bit/24bit
CRT/DVI 0/DVI 0/DVI 0/DVI 0/DVI 0/DVI 0/DVI
Common - - - - - -
Supply Voltage 5V/8-14V DC/±5% 5V DC/±5% +5VDC/ ±5% +5VDC/ ±5% +5V DC/ ±5% +3.3VDC/+-5%
Power Consumption 4W typ. 4W typ. 2-4W typ. - 4W typ. -
Operating Temperature 0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
opt. -40°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
opt. -40°C - +85°C
0°C - +85°C
opt. -25°C - +85°C
opt. -40°C - +85°C
Size 100x72x15mm
(lxbxd)
100x72x15mm
(LxBxH)
47x62.1x11mm
(lxbxd)
70x70x11mm
(lxbxd)
70x70x11mm
(LxBxH)
80x50x10mm
(lxbxd)
Weight ~60g ~60g ~15g ~25g ~25g ~20g
Long Term Availability 2027 2027 2027 2027 2027 2027
armStone™A9 armStone™A9r2 efus™A9 QBlissA9 QBlissA9r2 PicoMODA9

Modules with NXP i.MX 6SoloX Application Processors

NXPiMX6solox

The NXP i.MX 6SoloX is the first processor to use the Arm Cortex-A9 and Cortex-M4 core simultaneously, providing a highly integrated multi-market solution.
It provides a secure implementation to allow simultaneous execution of multiple software environments (e.g. Linux and real-time FreeRTOS)

Click on the board name to get detailed information.

 


efus™A9X PicoCOMA9X PicoCore™MX6SX
State Production Production Production
CPU - - -
CPU NXP i.MX 6SoloX NXP i.MX 6SoloX NXP i.MX 6SoloX
Core ARM Cortex-A9 + Cortex-M4 ARM Cortex-A9 + Cortex-M4 ARM Cortex-A9 + Cortex-M4
No of Cores 1 + M4 1 + M4 1 + M4
Frequency max. 1GHz + 200MHz max. 1GHz + 200 MHz max. 800MHz + 200MHz
L2-Cache 256KB 256KB 256KB
GPU 2D, 3D NEON
FPU
3D, 2D
Operating System - - -
Android Lollipop 5.1.1 - -
Linux Buildroot
Yocto
(uboot installed)
Buildroot
Yocto
(uboot installed)
Buildroot/ Yocto
(uboot installiert)
Windows WEC 2013
(Bootloader installed)
WEC 7
WEC 2013
(EBoot installed)
on request
Real Time FreeRTOS FreeRTOS FreeRTOS
Memory - - -
Flash max. 512MB
max. 32GB eMMC
max. 1GB max. 512MB SLC NAND
oder max. 32GB eMMC
RAM max. 2GB max. 512MB max. 1GB DDR3L
Interfaces - - -
SD-Card 2x extern 1x extern 1x extern
Ethernet 2x 100/1000Mb 1-2x 10/100Mb
IEEE 1588
max. 2x 100/1000Mb
WiFi IEEE802.11 b/g/n/ac* - -
BT BT 2.1+EDR 4.0/4.1
with antenna socket
opt. chip antenna
- -
USB Host 1x 1x 1x
USB Device 1x 1x 1x OTG 2.0
CAN 2x 1-2x max. 2x
UART 4x 2-3x max. 5x
I2C 2x 1x max. 3x
SPI 2x 1x max. 2x
Audio I2S Line In/Out Line In/ Out/ Mic/ Headphone/I2S
Digital I/O - max. 48 -
Touch Panel analog resitive and PCAP Touch ext. via I2C 4-wire, analog resistive
PCAP-Touch via I2C
analog resistive and PCAP Touch ext. via I2C
Camera analog/digital 1/Parallel 8bit - -
PCIe 1x - -
RTC on board/ external IC - external IC
additional Interfaces - - max. 8x PWM,
SPDIF, ESAI,
SAI, SSI ADR/ DATA Bus
Display - - -
RGB 18bit 16/18bit 16/ 24bit
LVDS 1x 24bit
opt. 1x 18bit LVDS via MXM2
- -
Common - - -
Supply Voltage +5VDC/ ±5% +3,3V DC/ ±5% +3.8V bis 5.5VDC
Power Consumption 2W typ. 2W typ. 2W typ.
Operating Temperature 0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C
opt. -40°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
Size 47x62.1x11mm
(lxbxd)
40x50mm
(LxB)
35x40mm
(LxB)
Weight ~15g ~15g ~10g
Long Term Availability 2030 2030 2030
efus™A9X PicoCOMA9X PicoCore™MX6SX

Modules with NXP i.MX 6UltraLite/ ULL Application Processors

NXPiMX6UL

The i.MX 6ULL/ UltraLite is an energy-efficient and cost-optimized application processor with a Cortex-A7 core that operates at speeds of up to 900 MHz. The CPU includes an integrated power management module that reduces the complexity of an external power supply and simplifies power sequencing. It offers a variety of interfaces for connecting peripheral devices such as WLAN, BT, displays and camera sensors.

Click on the board name to get detailed information.

 


efus™A7UL PicoCOM1.2 PicoCOMA7 PicoCore™MX6UL
State Production Production Production Production
CPU - - - -
CPU NXP i.MX 6UL/ULL NXP i.MX 6UL NXP i.MX 6ULL NXP i.MX 6ULL
Core ARM Cortex-A7 ARM Cortex-A7 ARM Cortex-A7 ARM Cortex-A7
No of Cores 1 1 1 1
Frequency max. 900MHz max. 696MHz max. 900MHz max. 900MHz
L2-Cache 128KB 128KB 128KB 128KB
GPU - NEON - -
Operating System - - - -
Linux Buildroot
Yocto
(uboot installed)
Buildroot/Yocto
(uboot installed)
Buildroot
(uboot installed)
Buildroot/ Yocto
(uboot installiert)
Windows WEC 2013
(Bootloader installed)
WEC 2013
(Bootloader installed
WEC 7
WEC 2013
(Bootloader installed)
auf Anfrage
Memory - - - -
Flash max. 512MB
max. 32GB eMMC
max. 1GB SLC NAND max. 512MB NAND max. 512MB SLC
oder max. 32GB eMMC
RAM max. 1GB max. 512MB max. 1GB max. 1GB DDR3L
Interfaces - - - -
SD-Card 2x extern 1x extern 1x extern 1x extern
Ethernet 2x 10/100Mb 10/100Mb 1-2 10/100MB IEEE1588 max. 2x
WiFi IEEE802.11b/g/n/ac* - - -
BT BT 2.1/ EDR 3.0/ 4.1 LE
with antenna socket
opt. chip antenna
- - -
USB Host 1x 1x 1x 1x
USB Device 1x 1x 1x 1x
CAN 2x 2x 1-2x max. 2x
UART 6x 6x 3x max. 6x
I2C 4x 2x 1-2x max. 4x
SPI 4x 2x 1x max. 4x
Audio I2S Line In/Out/analog Line In/Out Line In/ Out/ Mic/ Headphone/ I2S
Digital I/O - - max. 48 -
Touch Panel analog resistive and PCAP Touch ext. via I2C - 4-wire, analog resistive PCAP-Touch via I2C analog resistive und PCAP Touch ext. via I2C
Camera analog/digital 0/parallel 8bit - - -
RTC on board/ external IC - external IC external IC
additional Interfaces - - - max. 8x PWM,
SPDIF, ESAI,
3x SAI, SSI ADR/ DATA Bus
Display - - - -
RGB 18/24bit - 16/18 Bit 24bit
LVDS opt. 18bit LVDS via MXM2 - external -
Common - - - -
Supply Voltage +5VDC/ ±5% +3,3V DC/ ±5% +3,3V DC/ ±5% +3.8V bis 5.5VDC
Power Consumption 1-2W typ. 1,5W typ. 1-2W typ.
Operating Temperature 0°C - +70°C
opt. -20°C - +70°C
-40°C - +85°C
0°C - +70°C
opt. -25°C - +85°C
0°C - +70°C
opt. -25°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
Size 47x62.1x11mm
(LxBxH)
40x50mm
(LxB)
40x50mm
(LxB)
35x40mm
(LxB)
Weight ~15g ~15g ~15g ~10g
Long Term Availability 2030 2030 2031 2031
efus™A7UL PicoCOM1.2 PicoCOMA7 PicoCore™MX6UL

Modules with NXP i.MX 7ULP Application Processor

NXPiMX7ULP

The i.MX 7ULP is NXP's pioneer in ultra-low power processing for devices with long battery life. Designed for the growing market of portable devices, the i.MX 7ULP processor features advanced implementation of the Arm Cortex-A7 core, Arm Cortex-M4 core, and 3D and 2D Graphics Processing Units (GPUs). The i.MX 7ULP offers a range of interfaces for connecting WLAN, BT, displays and cameras.

Click on the board name to get detailed information.

 


PicoCore™MX7ULP
State Production
CPU -
CPU NXP i.MX 7ULP
Core ARM Cortex-A7 + Cortex-M4
No of Cores 1 + M4
Frequency max. 720MHz
L2-Cache 256KB
GPU 3D, 2D
Operating System -
Linux Yocto, Buildroot
(uboot installed)
Real Time FreeRTOS
Memory -
Flash max. 64MB QSPI
max. 32GB eMMC
RAM max. 1GB LPDDR3
Interfaces -
SD-Card 1x external
WiFi 802.11 ac/a/b/g/n
BT 5.0 LE
USB Device 1x OTG
UART 5x
I2C 3x
SPI 1x
Audio Line In/ Out/ Mic/ Headphone
Touch Panel analog resistive and PCAP Touch ext. via I2C
RTC external IC
Display -
LVDS
MIPI-DSI
Common -
Supply Voltage +5VDC/ ±5% / 4.2V Battery
Power Consumption 0,3W typ.
Operating Temperature 0°C - +70°C
opt. -20°C - +85°C
Size 35x40mm
(LxB)
Weight ~10g
Long Term Availability 2029
PicoCore™MX7ULP

Modules with NXP QorIQ LS1012A Layerscape Application Processors

NXPLayerscape

Click on the board name to get detailed information.

 


efus™A53LS
State Samples
CPU -
CPU NXP QorlIQ LS1012A (Layerscape)
Core ARM Cortex-A53
No of Cores 1
Frequency max. 800MHz
L2-Cache 64 kB
Operating System -
Linux Buildroot
Yocto
(uboot installed)
Memory -
Flash max. 64MB QSPI NOR
RAM max. 512MB DDR3L
Interfaces -
SD-Card 1x extern (opt.)
Ethernet 2x 100/1000Mb
WiFi IEEE802.11b/g/n/ac*
USB Host 1x OTG
CAN 1x (opt.)
UART 1x
I2C 2x
SPI 1x (opt.)
Digital I/O max. 27
PCIe 1x
SATA 1x
RTC on board/ external IC
additional Interfaces BT 2.1 + EDR, 4.0/4.1
with antenna socket
opt. chip antenna
Display -
Common -
Supply Voltage +5VDC/ ±5%
Power Consumption 1W typ.
Operating Temperature 0°C - +70°C
opt. -20°C - +85°C
Size 47x62.1x11mm
(LxBxH)
Weight ~15g
Long Term Availability 2031
efus™A53LS

Modules with NXP Vybrid Controllers

NXPVybrid

Click on the board name to get detailed information.

 


armStone™A5 PicoCOMA5 PicoMODA5 PicoMOD1.2 NetDCUA5
State production Production Production Production no new developments
CPU - - - - -
CPU NXP Vybrid NXP Vybrid NXP Vybrid NXP Vybrid NXP Vybrid
Core ARM Cortex-A5 + Cortex-M4 Cortex-A5 + Cortex-M4 ARM Cortex-A5 + Cortex-M4 Cortex-A5 + Cortex-M4 ARM Cortex-A5 + Cortex-M4
No of Cores Single-/Dual-Core Single-/Dual-Core Single-/Dual-Core Single-/Dual-Core Single-/Dual-Core
Frequency max. 500MHz & 167MHz max. 500MHz + 167 MHz max. 500MHz + 167 MHz max. 500MHz + 167MHz max. 500MHz + 167MHz
L2-Cache 512KB 512kB 512KB 512KB 512KB
GPU NEON NEON
FPU
NEON
FPU
NEON
FPU
NEON
Operating System - - - - -
Linux Buildroot
(uboot installed)
Buildroot
(uboot installed)
- - Buildroot
Windows WCE 6.0
WEC 7
WEC 2013
WCE 6.0 R3
WEC 7
WEC 2013
(Bootloader installed)
WEC 7 WCE 6.0
WEC 7
WEC 2013
WCE 6.0
WEC 2013
Real Time - MQX - MQX -
Memory - - - - -
Flash max. 1GB max. 1GB max. 256MB max.1GB max. 1GB
RAM max. 512MB max. 512MB 256MB max. 512MB max. 512MB
Interfaces - - - - -
SD-Card 1x microSD on-board extern 1x extern
1x on-board
1x extern 1x on-board
Ethernet 2x 10/100Mb
IEEE 1588
2x 10/100MB
IEEE 1588
10/100Mb 10/100Mb 2x 10/100Mb
IEEE1588
USB Host 1-2x 1-2 1x 1-2x 1x
USB Device 1x 1 1x 1x 1x
CAN 1-2x 1-2 1x - 2x
UART 3x 3 3-4x 3x 3x
I2C 1-2x 1-2 1x 1x 1x
SPI 1x 1 1x 1x 1x
Audio Line In/Out/Mic Line In/Out Line In/Out/Mic - Line In/Out/Mic
Digital I/O max. 66 - max. 45 - max. 21
Touch Panel 4-wire, analog resistive;
PCAP-Touch via I2C
4-wire, analogue resistive; PCAP-Touch via I2C 4-wire, analog resistive
PCAP Touch via I2C
- 4-wire, analog resistive
PCAP Touch via I2C
Camera analog/digital - - 4/0 optional - -
additional Interfaces - 4x 12Bit ADC (opt.) - - -
Display - - - - -
RGB 18Bit 16/18bit 18bit 18bit 18bit
LVDS 18Bit extern - - -
Common - - - - -
Supply Voltage 5V/8-14V DC / ±5% +3,3V DC/ + - 5% +3,3V DC/ ±5% +3,3V DC/ ±5% +5V DC/ ±5%
Power Consumption 3W typ. 1W typ. 1W typ. 1,5W typ. 1,5W typ.
Operating Temperature 0°C - +70°C
opt. -25°C - +85°C
0°C - +70°C
opt. -20°C - +85°C
0°C - +70°C 0°C - +70°C 0°C - +70°C
opt. -25°C - +85°C
Size 100x72x15mm
(lxbxd)
40x50mm
(lxb)
80x50mm
(lxb)
80x50mm
(lxb)
100x80x11mm
(lxbxd)
Weight ~55g ~10g ~20g - ~45g
Long Term Availability 2023 2023 2023 2023 2023
armStone™A5 PicoCOMA5 PicoMODA5 PicoMOD1.2 NetDCUA5

Modules with NXP i.MX RT1050 Application Processors

NXPiMXrt

Click on the board name to get detailed information.

 


PicoCore™RT1
State Samples
CPU -
CPU NXP i.MX RT1050
Core ARM Cortex-M7
No of Cores 1
Frequency max. 600MHz
L2-Cache 32KB
GPU 2D
Operating System -
Real Time FreeRTOS
Memory -
Interfaces -
SD-Card 1x external
Ethernet 1
USB Host 1
USB Device 1x OTG 2.0
CAN max. 2x
UART max. 3x
I2C max. 4x
SPI max. 2x
Audio Line In/ Out/ Mic/ Headphone/I2S
Touch Panel analog resistive and PCAP Touch ext. via I2C
RTC 1x
additional Interfaces PWM, ADC, GPIO
Display -
RGB 16bit
Common -
Supply Voltage +3.8V bis 5.5VDC
Power Consumption 1W typ.
Operating Temperature 0°C - +70°C
opt. -40°C - +85°C
Size 35x40mm
(LxB)
Weight ~10g
Long Term Availability 2031
PicoCore™RT1