Solder-on modules

Solder-on modules from F&S

As a specialist for customized embedded systems, F&S has now also added solder-on modules to its product portfolio.

The new FS 8MM OSM-SF module with the NXP i.MX8M Mini processor (30x30mm) is the first. Others will follow.

The advantages of solder-on modules are, among other things, that they can be directly soldered on - as the name suggests - and can be assembled by machine in the SMT assembly process. This means that connectors can be dispensed with, thus reducing costs. With the smaller form factors, the solder-on modules can reach new fields of application that the existing module standards cannot serve. Examples include very small and mobile IoT applications or applications with high physical loads.

OSM

Features:

Size-S „Small“ 30x30mm
332 contacts
Open Source Standard / second source
Can be soldered on directly (can be equipped by machine)
Scalable
Standardized interfaces
No connectors
single side mounted
I/O voltage 1V8

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SolderCore™

Features:

35x35 mm
220 LGA contacts
All features of SoC available
Can be soldered on directly (can be equipped by machine)
No connectors
Easy layout
single side mounted
selectable I/O voltaage (1V8 / 3V3)
Voltage for carrier board: 1V8 / 300mA or 3V3 / 1A

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SolderCore8ULP BOT+TOPs

Solder-on modules