phonenumber +49(0)711 123722-0
|
DE EN

SolderCore™

Features

  • SOM 35 x35 mm
  • LGA module with 220 contacts
  • Single power supply 5V
  • Selectable I/O voltage (1.8V or 3.3V)
  • Direct solderable
    (can be equipped by machine)
  • No connectors
  • Nearly all functions of SoC available


SolderCore™8ULP
State Samples
CPU -
CPU NXP i.MX 8ULP
Core ARM Cortex-A35 + Cortex-M33 + Hifi 4 DSP
No of Cores 1-2x A35 + 1x M33 + Hifi 4 DSP
Frequency 1GHz + 216MHz + 600MHz
GPU 2D / 3D GPU OpenGL/CL 3.1
Operating System -
Linux Yocto (uboot installed)
Real Time FreeRTOS
Memory -
eMMC 32GB eMMC
RAM 2GB LPDDR4
Interfaces -
SD-Card max. 2x external
Ethernet 1x 100 Mb
USB Host 1x OTG 2.0
USB Device 1x OTG 2.0
CAN Flex CAN
UART max. 8x
I2C max. 6x / max. 3x I3C
SPI max. 4x
Audio max. 6x I2S
Touch Panel Touch via I2C
Camera analog/digital 0/MIPI-CSI
RTC CPU or external IC
additional Interfaces EPDC
Display -
RGB 24 bit
MIPI-DSI 1x 4 lanes
Common -
Supply Voltage 2.7V up to 5.5V DC/±5%
Power Consumption tbd typ.
Operating Temperature 0°C - +70°C opt. -40°C - +85°C
Size 35x35mm
(LxB)
Weight 8g
Long Term Availability 2035
SolderCore™8ULP

SolderCore is a module family with LGA contacts without connectors. The idea is to offer the customer almost all functions of the SoC used. Due to the size of the contacts and the position of the contacts, it is possible to use the module in combination with a four-layer carrier board.

For the start of development, we recommend:

Starterkit SolderCore™8ULP Linux
  990,- €
Tax not included

SolderCore™8ULP-V4-LIN, base board, cable kit, 3.5" MIPI-DSI Display, access data to documentation and software