SolderCore8ULP

Solder Module with NXP i.MX8ULP CPU

For the start of development, we recommend:

	SolderCore™8ULP
State	Samples
CPU
CPU	NXP i.MX 8ULP
Core	ARM Cortex-A35 + Cortex-M33 + Hifi 4 DSP
No of Cores	1-2x A35 + 1x M33 + Hifi 4 DSP
Frequency	1GHz + 216MHz + 600MHz
GPU	2D / 3D GPU OpenGL/CL 3.1
Operating System
Linux	Yocto (uboot installed)
Real Time	FreeRTOS
Memory
eMMC	32GB eMMC
RAM	2GB LPDDR4
Interfaces
SD-Card	max. 2x external
Ethernet	1x 100 Mb
USB Host	1x OTG 2.0
USB Device	1x OTG 2.0
CAN	Flex CAN
UART	max. 8x
I2C	max. 6x / max. 3x I3C
SPI	max. 4x
Audio	max. 6x I2S
Touch Panel	Touch via I2C
Camera analog/digital	0/MIPI-CSI
RTC	CPU or external IC
additional Interfaces	EPDC
Display
RGB	24 bit
MIPI-DSI	1x 4 lanes
Common
Supply Voltage	2.7V up to 5.5V DC/±5%
Power Consumption	tbd typ.
Operating Temperature	0°C - +70°C opt. -40°C - +85°C
Size	35x35mm (LxB)
Weight	8g
Long Term Availability	2035

	SolderCore™8ULP-V4-LIN
State	Samples
CPU	-
CPU	NXP i.MX 8ULP
Core	ARM Cortex-A35 + Cortex-M33
No of Cores	2 + -M33
Frequency	1GHz + 216MHz
GPU	2D / 3D GPU OpenGL/CL 3.1
Operating System	-
Linux	Yocto (uboot installed)
Real Time	FreeRTOS
Memory	-
eMMC	4GB eMMC
RAM	1GB LPDDR4
Interfaces	-
SD-Card	2x external
Ethernet	1x 100 Mb
USB Host	1x OTG 2.0
USB Device	1x OTG 2.0
CAN	Flex CAN
UART	8x
I2C	6x /3x I3C
SPI	4x
Audio	6xb I2S
Touch Panel	Touch via I2C
Camera analog/digital	0/MIPI-CSI
RTC	CPU
additional Interfaces	EPDC
Display	-
RGB	24 bit
MIPI-DSI	1x 4 lanes
Common	-
Supply Voltage	2.7V up to 5.5V DC/±5%
Power Consumption	tbd typ.
Operating Temperature	0°C - +70°C
Size	35x35mm (LxB)
Weight	8g
Long Term Availability	2035
	SolderCore™8ULP-V4-LIN

Starterkit SolderCore™8ULP Linux
SolderCore™8ULP-V4-LIN, base board, cable kit, 3.5" MIPI-DSI Display, access data to documentation and software
SKU: SC8ULP-SKit

990,- €

Coming soon!

Buildroot und Yocto

Das Linux-BSP "fsimx6-B2022.10" basiert auf Buildroot, einer Software zur Erstellung von Root-Filesystemen. Über Buildroot können menügesteuert ca. 1400 verschiedene Softwarepakete dem Root-Filesystem hinzugefügt werden. Der Funktionsumfang reicht hier von einfachen Bibliotheken und Utilities über eine komplette Java-Umgebung bis hin zu vollständigen grafischen Umgebungen wie Qt, Wayland/Weston oder X11, inklusive Applikationen wie z.B. einem HTML5-fähigen Webbrowser. Auf diese Weise lässt sich sehr einfach ein maßgeschneidertes Linux-System zusammenstellen.

Alternativ zu Buildroot gibt es auch eine Yocto-basierte Umgebung. Wir bieten das Linux BSP fsimx6-Y2022.09 an, das auf Yocto basiert.

Unsere Standardkonfiguration, die einen ersten Eindruck vom Funktionsumfang der Baugruppe geben soll, enthält unter anderem folgende Features: Busybox, gdb, alsa-utils, gstreamer, fbv, X11R7, matchbox, feh, openssl, openssh, ncurses, can-utils, iproute2, ftpd, httpd, telnet, tftp, u.v.m.

Beide BSPs beinhaltet die von F&S angepassten Quelltextpakete von U-Boot (2018.03), Linux-Kernel (basierend auf 5.4.70) und Buildroot (2021.02.10) oder Yocto (3.0). Außerdem ist unsere Cross-Toolchain beigefügt, einige Beispielsapplikationen, sowie alle Binaries in der Standardkonfiguration. Und nicht zuletzt sind ausführliche Dokumente zur Hardware enthalten sowie die First-Steps-Dokumentation für den leichten Einstieg.

F&S bietet auch eine Virtuelle Maschine (basierend auf VirtualBox) mit einem installierten Linux basierend auf der Distribution Fedora 27 zum kostenlosen Download an. Alle zum Übersetzen unserer Software notwendigen Pakete sind bereits installiert. Ebenfalls sind alle Services (NFS, TFTP) zum Arbeiten mit unseren Boards installiert. Unser BSP liegt ausgepackt und vorkompiliert in den richtigen Verzeichnissen. Mit dieser virtuellen Maschine spielt es keine Rolle ob sie als Host Windows oder Linux verwenden. Einfach die VHD downloaden, in VirtualBox importieren und die Entwicklung kann sofort beginnen.

➜ Mehr Informationen über das neue Buildroot Release B2022.10
➜ Mehr Informationen über das neue YOCTO Release Y2022.09

SC8ULP - Product Flyer

Usage

By downloading you accept our general terms and conditions.

Download

English (479 KB, pdf) - 18/04/2023

SC8ULP - Hardware

Usage

By downloading you accept our general terms and conditions.

Download

SC8ULP Hardware Documentation (448 KB, pdf) - 17/04/2023

Usage

By downloading you accept our general terms and conditions.

Download

SC8ULP Ethernet Adapter Documentation (987 KB, pdf) - 23/01/2024

Usage

By downloading you accept our general terms and conditions.

Download

SC8ULP Starterkit Hardware Documentation (448 KB, pdf) - 31/01/2024

Usage

By downloading you accept our general terms and conditions.

Download

SolderCoreBBHD Battery Adapter (1 MB, pdf) - 31/01/2024

Usage

By downloading you accept our general terms and conditions.

Download

Baseboard Circuit Diagram (1.3 MB, pdf) - 01/06/2022
Baseboard 3D Step Model

Usage

By downloading you accept our general terms and conditions.

Download

SC8ULP Baseboard Ethernet Adapter (987 KB, pdf) - 23/01/2024

Usage

By downloading you accept our general terms and conditions.

Download

SC8ULP Baseboard Battery Adapter (1 MB, pdf) - 31/01/2024

SC8ULP - Linux

Usage

By downloading you accept our general terms and conditions.

Download

Advice for Linux on PC (2 MB, pdf) - 10/01/2018

Usage

By downloading you accept our general terms and conditions.

Download

i.MX 8ULP Linux First Steps (3.2 MB, pdf) - 01/02/2024

Usage

By downloading you accept our general terms and conditions.

Download

DOTNET on F&S Boards (333 KB, pdf) - 16/01/2024

Variants

SolderCore™8ULP-V4-LIN
NXP i.MX 8ULP ARM Cortex-A35 + Cortex-M33, 1GB RAM, 4GB eMMC, Audio, MIPI-DSI, 0°C - +70°C, 5V Supply, Linux Yocto
SKU: SC8ULP-V4-LIN

Request

Starterkit

Starterkit SolderCore™8ULP Linux
SolderCore™8ULP-V4-LIN, base board, cable kit, 3.5" MIPI-DSI Display, access data to documentation and software
SKU: SC8ULP-SKit

990,- €

Link to the Forum

You will always find support in our Forum.

Current Contributions

25 Apr, 07:45	u-boot-fus support for A/B update scheme
24 Apr, 13:26	New Buildroot Release fsimx6-B2024.04
24 Apr, 13:24	New F&S Development Machine - Fedora36-arm32
23 Apr, 09:45	GPIO not working
19 Apr, 10:38	File System Build on new Fidora x86 Maschine
19 Apr, 09:19	Device tree for Toshiba TC358775 DSI to LVDS bridge
19 Apr, 09:08	PicoCoreMX8MM eMMC partition table: MBR or GPT?
15 Apr, 10:34	Y2023.09: xwayland RDP problems with Chromium & and chromium-derived APPs (such as Electron)
13 Apr, 00:51	Configuring ATF for power optimization
10 Apr, 09:14	Creating Y2022.09 for armStoneA9

Compact Solder Module		Long-Term Availability until minimum 2035
Our small, compact SolderCore solder-on module is the ideal solution for the i.MX 8ULP from NXP. The extremely power-saving CPU i.MX 8ULP is especially suitable for portable, battery-powered devices. The SolderCore8ULP makes it easy to connect all important interfaces to a baseboard. NXP's i.MX 8ULP crossover application processor offers ultra-low power processing and advanced integrated security with EdgeLock® Secure Enclave. A dedicated power management subsystem offers more than 20 power mode combinations for efficient applications. Heterogeneous multicore processor concept The i.MX 8ULP is a heterogeneous multicore application processor for embedded modules. It is ideal for applications that require high-performance graphics processing and multimedia functions and Industry 4.0 applications. The processor consists of a single or dual ARM® Cortex®-A35 core running at up to 1GHz and a Cortex®-M33 core for real-time processing running at 216 MHz. The processor also features a HIFI 4 DSP. The i.MX 8ULP offers various audio and voice functions via I2S. ➜ more information about the NXP i.MX 8ULP		The highlights of our module are NXP i.MX 8ULP Dual ARM® Cortex®-A35 @1.0 GHz +-M33 @216 MHz 2GB LPDDR4, 64GB eMMC E-Paper, MIPI-DSI, RGB, 2D/3D GPU, MIPI-CSI I2S, 2x USB, LAN, FlexCAN 6x UART, 6x I2C, 4x SPI Extremely low power consumption We offer extensive software support including Linux BSP, Update Solution, and Secure Boot. This makes the SolderCore™MX8ULP a perfect solution for all kinds of ultra-low power devices. Operating System The operating system customized for SolderCore8ULP is Linux. Linux Yocto supports all interfaces, ensuring easy software development without much hardware knowledge. FreeRTOS is available to control the real-time kernel -M33. NXP i.MX 8ULP Linux Development Board For an easy development start we offer an immediately executable SolderCore8ULP starter kit. It includes an embedded board, a baseboard, a 3.5" MIPI display, cables, and access to documentation and software. The software consists of the Board Support Package and Bare Metal or FreeRTOS toolchain. This is rounded off by our wide range of software services, workshops and free support via the forum, e-mail and telephone.

Compact Solder Module

Long-Term Availability until minimum 2035

Our small, compact SolderCore solder-on module is the ideal solution for the i.MX 8ULP from NXP. The extremely power-saving CPU i.MX 8ULP is especially suitable for portable, battery-powered devices. The SolderCore8ULP makes it easy to connect all important interfaces to a baseboard.
NXP's i.MX 8ULP crossover application processor offers ultra-low power processing and advanced integrated security with EdgeLock® Secure Enclave. A dedicated power management subsystem offers more than 20 power mode combinations for efficient applications.

Heterogeneous multicore processor concept

The i.MX 8ULP is a heterogeneous multicore application processor for embedded modules. It is ideal for applications that require high-performance graphics processing and multimedia functions and Industry 4.0 applications.
The processor consists of a single or dual ARM® Cortex®-A35 core running at up to 1GHz and a Cortex®-M33 core for real-time processing running at 216 MHz. The processor also features a HIFI 4 DSP. The i.MX 8ULP offers various audio and voice functions via I2S.
➜ more information about the NXP i.MX 8ULP

The highlights of our module are

NXP i.MX 8ULP Dual ARM® Cortex®-A35 @1.0 GHz +-M33 @216 MHz
2GB LPDDR4, 64GB eMMC
E-Paper, MIPI-DSI, RGB, 2D/3D GPU, MIPI-CSI
I2S, 2x USB, LAN, FlexCAN
6x UART, 6x I2C, 4x SPI
Extremely low power consumption

We offer extensive software support including Linux BSP, Update Solution, and Secure Boot. This makes the SolderCore™MX8ULP a perfect solution for all kinds of ultra-low power devices.

Operating System

The operating system customized for SolderCore8ULP is Linux. Linux Yocto supports all interfaces, ensuring easy software development without much hardware knowledge.
FreeRTOS is available to control the real-time kernel -M33.

NXP i.MX 8ULP Linux Development Board

For an easy development start we offer an immediately executable SolderCore8ULP starter kit. It includes an embedded board, a baseboard, a 3.5" MIPI display, cables, and access to documentation and software. The software consists of the Board Support Package and Bare Metal or FreeRTOS toolchain.

This is rounded off by our wide range of software services, workshops and free support via the forum, e-mail and telephone.

SolderCore8ULP

Solder Module with NXP i.MX8ULP CPU

Buildroot und Yocto

Usage

Usage

Usage

Usage

Usage

Usage

Usage

Usage

Usage

Usage

Usage

Variants

Starterkit

Link to the Forum

Current Contributions

Heterogeneous multicore processor concept

Operating System

NXP i.MX 8ULP Linux Development Board

Support

Address