SolderCore™

Features

SOM 35 x 35 mm
LGA module with 220 contacts
Single power supply 5V
Direct solderable
(can be equipped by machine)
No connectors
Nearly all functions of SoC available
Selectable I/O voltage (1.8V or 3.3V)
Voltage for carrier board: 1V8 / 300mA or 3V3 / 1A

	SolderCore™8ULP
State	Samples
CPU	-
CPU	NXP i.MX 8ULP
Core	ARM Cortex-A35 + Cortex-M33 + Hifi 4 DSP
No of Cores	1-2x A35 + 1x M33 + Hifi 4 DSP
Frequency	1GHz + 216MHz + 600MHz
GPU	2D / 3D GPU OpenGL/CL 3.1
Operating System	-
Linux	Yocto (uboot installed)
Real Time	FreeRTOS
Memory	-
eMMC	32GB eMMC
RAM	2GB LPDDR4
Interfaces	-
SD-Card	max. 2x external
Ethernet	1x 100 Mb
USB Host	1x OTG 2.0
USB Device	1x OTG 2.0
CAN	Flex CAN
UART	max. 8x
I2C	max. 6x / max. 3x I3C
SPI	max. 4x
Audio	max. 6x I2S
Touch Panel	Touch via I2C
Camera analog/digital	0/MIPI-CSI
RTC	CPU or external IC
additional Interfaces	EPDC
Display	-
RGB	24 bit
MIPI-DSI	1x 4 lanes
Common	-
Supply Voltage	2.7V up to 5.5V DC/±5%
Power Consumption	tbd typ.
Operating Temperature	0°C - +70°C opt. -40°C - +85°C
Size	35x35mm (LxB)
Weight	8g
Long Term Availability	2035
	SolderCore™8ULP

SolderCore is a module family with LGA contacts without connectors. The idea is to offer the customer almost all functions of the SoC used. Due to the size of the contacts and the position of the contacts, it is possible to use the module in combination with a four-layer carrier board.

For the start of development, we recommend:

SolderCore™

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